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DISCONNECTOR PARALLEL CURRENT PATHS OPTIMIZATION
Görig, Tomáš ; Tůma, Jan (referee) ; Dohnal, Petr (advisor)
The objective of this master´s thesis is diagnostic the actual disconnector current path that is unevenly stressed by nominal current. The most stressed parts are excessively heated. In next part are projected a few options to optimize the current path. The options are verified by simulation. The best option is recommended to the submitter.
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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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Current distribution and heat losses in the low voltage circuit breakers
Musil, Pavel ; Janda, Marcel (referee) ; Makki, Zbyněk (advisor)
The work is focused on the calculation of decomposing the current and the thermal loss in circuit breakers of low voltage. In the work´s first half, there is a summary of the most frequently used circuit breaker elements with a focus on their constructional layout. The biggest attention is devoted to the circuit breaker marked LPN-16B by the company OEZ. A model of the under current trajectory of this specific element is created in a program Inventor on which the following calculation of decomposing the current and thermal loss was accomplished in a program Ansys. The obtained results are assessed in the conclusion of this work.
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FEM analysis of overcurrent trip unit
Makki, Zbyněk ; Augusta, Zbyněk (referee) ; Valenta, Jiří (advisor)
The aim of the project was to prepare the given model of the current path in the environment of the SolidWorks programme, in order to simulate the flow path in the environment of the Ansys programme, where there was calculated the distribution of current density,voltage drops and heat loss on the the specified current track according to specified conditions. The obtained results are analyzed at the conclusion of this work.
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Prediction of resistivity for thick film rezistor
Kolařík, Jaroslav ; Otáhal, Alexandr (referee) ; Skácel, Josef (advisor)
This work deals with issue the thick-film technology. Especially this work focuses on trimming value of resistance thick-film resistors. First part is dedicated to create the thick-film and thick-film resistors, trim technology and trim cuts. Next part is design of thick-film resistor and test substrate with resistors. The following is a description of the production the test substrate. Next part thesis deals with practical creation cuts into thick-film resistors by AUREL ALS300. The following is an experimental part dealing with the simulation of thick-film resistor with different trim cuts in the ANSYS Workbench. The last part is for practical verification of simulations measurement by the FLIR SC660 thermovision camera. At the end are evaluated knowledge of the properties of the trim cuts.
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Magnetic field analysis with finite element method and magnetic sensor
Volf, Tomáš ; Kurfűrst, Jiří (referee) ; Skalka, Miroslav (advisor)
The magnetic field analysis by MKP and magnetic probe project deals with magnetic field analysis of asynchronous machine cross section. This analysis is written in detail along with the necessary theory of asynchronous machine and the ANSYS program. The magnetic field of selected machine is measured by magnetic probe and results are compared with calculation. The next part of thesis is draft of device for the magnetic field analysis.
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Optimalization of CMOS Chip Interconnection Process for Higher Current Load
Novotný, Marek ; Mach,, Pavel (referee) ; Hulenyi,, Ladislav (referee) ; Szendiuch, Ivan (advisor)
This work deals with silicon chip interconnection with a view to high current up to 10A. A wire bonding method is used for interconnection. The first part of investigation is focused on the modeling and simulation by the help of program ANSYS. Thermo mechanical stressing and current density is important parts of this research. Stress and current density distribution are results of the first part. The experimental part describes transition resistance, electro migration and thermal process in the connection of wire and chip pad. A controlled current source (0 – 10A) is used for measurement. The current source makes it possible to 4-point method measurement with sampling rate 1,5MHz.
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Simulation of circuit-breaker trip unit
Dostál, Lukáš ; Augusta, Zbyněk (referee) ; Valenta, Jiří (advisor)
Securing of electrical devices is important not only to protect against destruction under the effects of electric current, but also for protection of people or animals against electric shock. With increasing of living standards goes hand in hand increasing of the electricity consumption. Therefore In the grid of low voltage, there are increasing short-circuit currents. With improving technology is posed considerable demand on the performance, security and switching capacity of circuit breakers. This thesis is oriented on development of thermal and electromagnetic switch of circuit breaker on which is put a big demand in development of new types of circuit breakers. The thesis is interesting because of comprehensive use of circuits’ breakers since it can be used in AC and DC networks with frequency of 50 Hz and 400 Hz.
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Prediction of resistivity for thick film rezistor
Kolařík, Jaroslav ; Otáhal, Alexandr (referee) ; Skácel, Josef (advisor)
This work deals with issue the thick-film technology. Especially this work focuses on trimming value of resistance thick-film resistors. First part is dedicated to create the thick-film and thick-film resistors, trim technology and trim cuts. Next part is design of thick-film resistor and test substrate with resistors. The following is a description of the production the test substrate. Next part thesis deals with practical creation cuts into thick-film resistors by AUREL ALS300. The following is an experimental part dealing with the simulation of thick-film resistor with different trim cuts in the ANSYS Workbench. The last part is for practical verification of simulations measurement by the FLIR SC660 thermovision camera. At the end are evaluated knowledge of the properties of the trim cuts.
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Current distribution and heat losses in the low voltage circuit breakers
Musil, Pavel ; Janda, Marcel (referee) ; Makki, Zbyněk (advisor)
The work is focused on the calculation of decomposing the current and the thermal loss in circuit breakers of low voltage. In the work´s first half, there is a summary of the most frequently used circuit breaker elements with a focus on their constructional layout. The biggest attention is devoted to the circuit breaker marked LPN-16B by the company OEZ. A model of the under current trajectory of this specific element is created in a program Inventor on which the following calculation of decomposing the current and thermal loss was accomplished in a program Ansys. The obtained results are assessed in the conclusion of this work.
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